Epoxy molding compounds with low thermal expansion coefficients.

A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds

Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds

Please cite this article in press as: Schreier-Alt T pounds. Microelectron Reliab (2010), doi:10.10 This paper presents new experimental and numerical methods to characterize the transfer overmolding of substrates with epoxy polymer. We investigated Multi Chip Modules on ceramic panels as well as on printed circuit boards encapsulated as a Mold Array Package (MAP). Experiments show that the pol...

Micromechanical Analysis of Thermal Expansion Coefficients

Thermal expansion coefficients play an important role in the design and analysis of composite structures. A detailed analysis of thermo-mechanical distortion can be performed on microscopic level of a structure. However, for a design and analysis of large structures, the knowledge of effective material properties is essential. Thus, either a theoretical prediction or a numerical estimation of t...

Development of Solution-Processable, Optically Transparent Polyimides with Ultra-Low Linear Coefficients of Thermal Expansion

This paper reviews the development of new high-temperature polymeric materials applicable to plastic substrates in image display devices with a focus on our previous results. Novel solution-processable colorless polyimides (PIs) with ultra-low linear coefficients of thermal expansion (CTE) are proposed in this paper. First, the principles of the coloration of PI films are briefly discussed, inc...

Thin films with ultra-low thermal expansion.

Ultra-low coefficient of thermal expansion (CTE) is an elusive property, and narrow temperature ranges of operation and poor mechanical properties limit the use of conventional materials with low CTE. We structured a periodic micro-array of bi-metallic cells to demonstrate ultra-low effective CTE with a wide temperature range. These engineered tunable CTE thin film can be applied to minimize th...